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PCIM Europe digital days
Dear Sir or Madam, 
PCIM Europe will take place in digital form from July 7 – 8, 2020. Further down in this mail you will find all our forum presentations, the round tables hosted by SEMIKRON and all our conference contributions to which we would like to invite you.
Participation in the PCIM Europe digital days is of course free of charge. Simply register on the PCIM Europe digital days website and put together your individual conference program or arrange individual appointments with our experts.
We look forward to welcoming you to our lectures and presentations.
Stay healthy and see you online,
Peter Sontheimer
Our Forum Presentations
eMobility Forum
eMPack - The New Automotive Power Platform by SEMIKRON
eMPack - The New Automotive Power Module Platform by SEMIKRON
July 7, 2020 & July 8, 2020
10:15 - 10:30 (CEST)
Speaker: Oliver Tamm
Our new power module platform eMPack, which is based on a single module concept, is being developed for EDS inverter architectures covering a power range from ~50kW up to ~750kW. The combination of Silicon Carbide technology with SEMIKRON’s fully sintered, low stray inductance Direct Pressed Die Technology (DPD) enables unmatched power densities combined with high reliability for automotive application.
Industry Forum
Parallel Operation of 3L NPC Power Modules
Parallel Operation of 3L NPC Power Modules
July 8, 2020
11:40 - 12:00 (CEST)
Speaker: Ingo Rabl
The presentation is about paralleling 3-level NPC power modules with up to 1.5MW output power utilizing only one common driver.
However, the well-known protection functionality known from separate drivers per module will be maintained.
The presentation explains the pros and cons of paralleling 3L modules, the actual status quo and the benefits of different solution.
Round Tables hosted by SEMIKRON
Round Table 1
The Key to Harvesting more Energy: Optimized Power Electronics!
The Key to Harvesting more Energy: Optimized Power Electronics!
July 7, 2020, 10:00 - 11:00 (CEST)
Bernhard Eichler & Emiliano Meza
With the growing demand on renewable energy, there is also a growing demand for highly efficient and highly reliable power electronic components. We will discuss our solutions from PCB based systems up to high power modules for solar, wind and energy storage systems. The presentation will show the benefits of 3-level topologies in NPC and ANPC using silicon devices, including the new generation 7 IGBTs, as well as silicon carbide technologies.
Round Table 2
From Motor Drive to Renewable Energy: Generation 7 IGBT, the new Workhorse in Power Electronics
From Motor Drive to Renewable Energy: Generation 7 IGBT, the new Workhorse in Power Electronics
July 8, 2020, 10:00 - 11:00 (CEST)
Stefan Häuser & Emiliano Meza
IGBT Generation 7 is the new workhorse in power electronics. During our Round Table at the digital days of PCIM Europe 2020 we would like to discuss their features and benefits for motor drive, solar and wind power applications with you.
Our Conference Contributions
Power Cycling Test Bench Topology with Alternating Load Current and Online Temperature Measurement for Thyristor Devices
Stream 2 – Power Cycling
July 7, 2020, 10:20 - 10:45 (CEST)
Maximilian Goller, Josef Lutz (Technical University of Chemnitz), Tom Simon (SEMIKRON), Norbert Reichenbach, Gerhard Mitic (Siemens) & Christian Herold (Valeo Siemens eAutomotive)
In this work power cycling tests on thyristor modules were performed under constant monitoring of the junction temperature. Therefore, two temperature sensitive electric parameters have been applied for second and minute duty cycles.
Potential and Challenges of Additive Manufactured Substrates and Auxiliary Material for Electronics
!!! Nominated for the Best Paper Award !!! 
Stream 3 – Design Tools and Applications II
July 8, 2020, 11:25 - 11:50 (CEST)
Michael Schleicher (SEMIKRON), Michael Matthes (Wittenstein cyber motor), Hanno Platz (GED Gesellschaft für Elektronik und Design)
Additive manufacturing principles will enforce within the industry the next few years. The reduction of resources and individualized Production is an additional driver for additive manufacturing. In a short overview, based on three representative - solder mask, sinter paste and PCB substrate - the current status of additive manufacturing within the electronic production will be shown. To obtain the benefit of those technologies the hitherto used process-flow, tools and used data formats must change.
110 kW, 2.6 l SiC-Inverter for DRIVEMODE - a Highly Integrated Automotive Drivetrain
Dialogue Session PP165 – Automotive II
July 8, 2020, 15:00 - 16:30 (CEST)
Roland Bittner, Sandro Bulovic, Matthias Kujath, Sven Bütow & Nicola Burani (SEMIKRON), Nathalie Becker (Technical University of Ilmenau)
The design of a three-phase 110kW, 2.6l high frequency switching silicon carbide inverter developed within the DRIVEMODE project is presented. The power electronic device is part of an integrated automotive drivetrain and is attached to a high-speed motor using a novel pressure contact based AC connection. The design is optimized to minimize material and cost of power components by optimized cooling.
PCIM Europe digital days